Semiconductor Metal Housing Connecting Rod
Product Category: Semiconductor Industry
Product Keywords: Mim
Material: Stainless Steel 316l 304
Surface Treatment Requirements: Polishing
Dimension Tolerance Range: Customized
Product Size: 10mm±0.02-0.04mm
Forming Method: Powder Injection Molding
Sintering Method: Solid Phase Sintering
Sintering Environment: Vacuum
Mold Material: Steel
If you have any questions, you are always welcome to contact us. We'll get back to you as soon as possible, within 24 hours on weekdays and weekends.
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We offer comprehensive Lifetime Technical Support and Warranty Services.
Contact Us
WhatsApp: +86 180 0255 3024
Email: market@mim-supplier.com
Shipping Information
We usually send samples to you via DHL FedEx or UPS.
Bulk goods will be shipped by sea to save shipping costs
FAQ’s
What materials do you provide?
We offer a wide range of materials for powder metallurgy.
MIM: 304 316 420 17-4 Stainless Steel, TC4 TA2 Titanium Alloys, AISI 310S Nickel-Chromium-Iron Alloys
CIM Process: Zirconia, Alumina, Silicon Nitride, Silicon Carbide, and Aluminum Nitride
Our R&D team can develop customized materials to meet your specific application requirements.