Aluminum Nitride AlN for Ceramic Injection Molding

Aluminum Nitride (AIN) for Ceramic Injection Molding

Aluminum nitride (AlN) is a technical ceramic material known for its combination of high thermal conductivity and excellent electrical insulation. With thermal conductivity typically ranging from 140 to 180 W/m·K, AlN offers clear advantages in electronic heat dissipation and semiconductor applications. It also features a low coefficient of thermal expansion and good thermal stability, making it well suited for thermally conductive insulating substrates, electronic packaging, semiconductor equipment components, and other precision ceramic parts with demanding thermal management requirements.

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Aluminum Nitride (AlN) Material Property Analysis Table

Material AIN
94%+
Color Ivory
Density g/cm³ 3.3
Water Absorption %
Vickers Hardness GPa
Vickers Hardness HV 350
Bending Strength MPa
Compressive Strength MPa
Elastic Modulus GPa
Fracture Toughness MPa·m1/2 12
Volume Resistance Ω·cm >10¹⁴
Permittivity 1MHz 8.5
Dielectric Dissipation Factor 1MHz
Insulation Endurance kV/mm
Coefficient of Thermal Expansion 10⁻⁶/℃ 4.5
Thermal Conductivity W/m·K 150
Maximum Use Temperature 1000
Heat-resistant Impact Temperature 400
Main Features
Main Uses

Material Characteristics Comparision Table

Thermal Expansion

Thermal Conductivity

Heat Shock Resistance

Compresslve Strength

Young's Modulus of Elasticty

Max.use TemperatureIn Atmosphere

Hardness

Chemical Durability

Flesural Strength UnderDifferent Temperature