
Aluminum Nitride (AIN) for Ceramic Injection Molding
Aluminum nitride (AlN) is a technical ceramic material known for its combination of high thermal conductivity and excellent electrical insulation. With thermal conductivity typically ranging from 140 to 180 W/m·K, AlN offers clear advantages in electronic heat dissipation and semiconductor applications. It also features a low coefficient of thermal expansion and good thermal stability, making it well suited for thermally conductive insulating substrates, electronic packaging, semiconductor equipment components, and other precision ceramic parts with demanding thermal management requirements.
Aluminum Nitride (AlN) Material Property Analysis Table
| Material | AIN 94%+ |
|
|---|---|---|
| Color | — | Ivory |
| Density | g/cm³ | 3.3 |
| Water Absorption | % | — |
| Vickers Hardness | GPa | — |
| Vickers Hardness | HV | 350 |
| Bending Strength | MPa | |
| Compressive Strength | MPa | — |
| Elastic Modulus | GPa | — |
| Fracture Toughness | MPa·m1/2 | 12 |
| Volume Resistance | Ω·cm | >10¹⁴ |
| Permittivity | 1MHz | 8.5 |
| Dielectric Dissipation Factor | 1MHz | — |
| Insulation Endurance | kV/mm | — |
| Coefficient of Thermal Expansion | 10⁻⁶/℃ | 4.5 |
| Thermal Conductivity | W/m·K | 150 |
| Maximum Use Temperature | ℃ | 1000 |
| Heat-resistant Impact Temperature | ℃ | 400 |
| Main Features | — | — |
| Main Uses | — | — |








