
Technical Ceramic Material Comparison
Silicon nitride, silicon carbide, and cordierite each offer distinct advantages in mechanical, thermal, and electrical performance. Silicon nitride provides high strength and fracture toughness, silicon carbide stands out for its very high hardness and wear resistance, and cordierite is valued for its low density, low dielectric constant, and near-zero thermal expansion at room temperature. This comparison helps engineers and buyers evaluate the most suitable ceramic material for different application requirements.
- Silicon nitride: high bending strength, compressive strength, and fracture toughness
- Silicon carbide: very high hardness and strong wear resistance for severe service conditions
- Cordierite: low density, low dielectric constant, and near-zero thermal expansion for thermal stability
Silicon Nitride, Silicon Carbide and Cordierite Material Properties
| Material | a-Si₃N₄ 96% |
SiC 97% |
2Mg0 ·2A1203 ·5Si02 | |
|---|---|---|---|---|
| Color | — | Light Gray | Black | White |
| Density | g/cm³ | 3.23 | 3.13~3.16 | 2.5 |
| Water Absorption | % | 0 | 0 | 0 |
| Vickers Hardness | GPa | — | — | 9 |
| Vickers Hardness | HV | 1500 | ≥2600 | — |
| Bending Strength | MPa | 720 | ≥400 | — |
| Compressive Strength | MPa | 2300 | — | — |
| Elastic Modulus | GPa | 300 | — | — |
| Fracture Toughness | MPa·m1/2 | 6.2 | — | — |
| Volume Resistance | Ω·cm | >10¹³ | 3.5~4.5 | >10¹⁴ |
| Permittivity | 1MHz | — | 33 | 4.9 |
| Dielectric Dissipation Factor | 1MHz | — | — | 9×10⁻⁴ |
| Insulation Endurance | kV/mm | — | — | — |
| Coefficient of Thermal Expansion | 10⁻⁶/℃ | 3.2 | — | 0.1 |
| Thermal Conductivity | W/m·K | 25 | — | 4.8 |
| Maximum Use Temperature | ℃ | 1050 | 1480 | — |
| Heat-resistant Impact Temperature | ℃ | — | — | — |
| Main Features | — | — | — | Thermal Expansion At Room Temperature: Nearly Zero Low Dielectric Constant High Heat Resistance |
| Main Uses | — | — | — | — |








