Tungsten Copper Alloy
Tungsten Copper Alloy
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Electronic encapsulation materials
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High heat conductivity, can quickly to the heat generated by the export electronic device
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Semiconductor materials that match the thermal expansion coefficient (2 ~ 6 W/m.K), avoid and electronic device interface of thermal stress and thermal fatigue
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Containing a large number of high hardness ceramic or metal particles, difficult processing
● Solution
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Powder injection molding (tungsten copper, kovar alloy, invar alloy, aluminum and silicon carbide, aluminum nitride, etc.)
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Interface structure control, and improve the thermal performance
Application of MIM Process:
● can direct sintering: tungsten copper alloy, kovar alloy, invar alloy, aluminum nitride
● aluminized after sintering: aluminum and silicon carbide, copper - diamond
Tungsten-copper alloy - Advantages: Tungsten-copper alloy
● High strength
● High proportion
● High temperature resistant
● Arc ablation resistance
● Conductive electric performance is good
Tungsten copper alloy - Purpose:
● Military high temperature resistant material
● 5g optical material
● Electrical alloy used in high pressure switch
● Machining electrode
● Microelectronics materials